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Resonant Cavity Enhanced Ge Photodetectors for 1550 nm Operation on Reflecting Si Substrates
64
Citations
12
References
2004
Year
Photonic DevicePhotonicsElectrical EngineeringEngineeringPhysicsReflecting Si SubstratesApplied PhysicsNm OperationHigh ReflectivityMicrowave PhotonicsSemiconductor Device FabricationGe Layer ThicknessPhotonic Integrated CircuitSilicon On InsulatorMicroelectronicsQuantum EfficiencyOptoelectronics
We have fabricated and characterized the first resonant cavity-enhanced germanium photodetectors on double silicon-on-insulator substrates (Ge-DSOI) for operation around the 1550-nm communication wavelength and have demonstrated over four-fold improvement in quantum efficiency compared to its single-pass counterpart. The DSOI substrate is fabricated using an ion-cut process and optimized for high reflectivity (>90%) in the 1300-1600-nm wavelength range, whereas the Ge layer is grown using a novel two-step ultra-high vacuum/chemical vapor deposition direct epitaxial growth technique. We have simulated a Ge-DSOI photodetector optimized for operation at 1550 nm, exhibiting a quantum efficiency of 76% at 1550 nm given a Ge layer thickness of only 860 nm as a result of both strain-induced and resonant cavity enhancement. For this Ge thickness, we estimate a transit time-limited 3-dB bandwidth of approximately 25 GHz.
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