Concepedia

Author

Ling Xie

Agency for Science, Technology and Research

Also Known As

Ling Xie, Xie Ling, Xie, Ling

67

Publications

424

Citations

12

H-Index

44

Concepts

All Affiliations

Agency for Science, Technology and ResearchInstitute of MicroelectronicsSingapore Science ParkGuangdong University of Technology
LX

About

Ling Xie is an author at Agency for Science, Technology and Research specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

8

8

172

2

Applied Physics

4

4

77

3

Medicine

1

1

12

4

Natural Sciences

1

1

22

5

Biomedical Engineering

1

1

13

Ling Xie

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14

Publications

311

Citations

12

H-Index

YearCitations

Crystallographic Orientation Dependent Reactive Ion Etching in Single Crystal Diamond

Ling Xie, Tony Zhou, Rainer Stöhr,

Advanced Materials

2018

54

Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging

Vivek Chidambaram, Ling Xie, Bangtao Chen

Journal of Electronic Materials

2012

42

Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking

Won Kyoung Choi, C.S. Premachandran, Ong Siong Chiew,

2009

30

High‐Performance Aqueous Zinc‐Ion Batteries Based on Multidimensional V<sub>2</sub>O<sub>3</sub> Nanosheets@Single‐Walled Carbon Nanohorns@Reduced Graphene Oxide Composite and Optimized Electrolyte

Junzhi Hong, Ling Xie, Chenglong Shi,

Small Methods

2023

27

VO<sub>2</sub>·0.26H<sub>2</sub>O nanobelts@reduced graphene oxides as cathode materials for high-performance aqueous zinc ion batteries

Ling Xie, Wenhai Xiao, Xiaoyan Shi,

Chemical Communications

2022

26

A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

C.S. Premachandran, John H. Lau, Ling Xie,

2008

22

6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking

Ling Xie, Sunil Wickramanayaka, Ser Choong Chong,

2016

22

The diversity of five metal–organic complexes based on an unsymmetrical biphenyl tetracarboxylate: Synthesis, structures, magnetism and luminescence

Sisi Feng, Ling Xie, Liping Lu,

Journal of Solid State Chemistry

2017

18

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Ling Xie, Sunil Wickramanayaka, Boo Yung Jung,

2014

13

Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) Application

Ling Xie, C.S. Premachandran, Michelle Chew,

IEEE Transactions on Advanced Packaging

2009

13

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