C.S. Premachandran

A two axes scanning SOI MEMS micromirror for endoscopic bioimaging

J. Singh, J H S Teo, Yi Xu et al. · Journal of Micromechanics and Microengineering · 2007 · 92 citations

Design and development of a 3D scanning MEMS OCT probe using a novel SiOB package assembly

Yi Xu, J. Singh, C.S. Premachandran et al. · Journal of Micromechanics and Microengineering · 2008 · 54 citations

Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking

Won Kyoung Choi, C.S. Premachandran, Ong Siong Chiew et al. · 2009 · 30 citations

Engineering, Interconnect (Integrated Circuits), Thin Film Indium +22

A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

C.S. Premachandran, John H. Lau, Ling Xie et al. · 2008 · 22 citations

Engineering, Wafer Scale Processing, Advanced Packaging (Semiconductors) +18

A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging

C.S. Premachandran, R. Nagarajan, Zhang Xiolin et al. · 2004 · 22 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +20