Concepedia

Ong Siong Chiew

OS

Statistics

Publications

3

Citations

54

H-Index

3

Active since

2006

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Ong Siong Chiew is an author at Institute of Microelectronics specializing in materials engineering, soldering joints, and natural sciences.

Publications per year

2006–2010

3

Publications

3

Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking

Won Kyoung Choi, C.S. Premachandran, Ong Siong Chiew et al. · 2009 · 30 citations

, , +14

Water-tolerant enantioselective carbonyl-ene reactions with palladium(II) and platinum(II) Lewis acid catalysts bearing BINAP

He‐Kuan Luo, Haiyan Yang, Tan Xiang Jie et al. · Journal of Molecular Catalysis A Chemical · 2006 · 12 citations

, , +13

Three chips stacking with low volume solder using single re-flow process

Navas Khan, David Ho Soon Wee, Ong Siong Chiew et al. · 2010 · 12 citations

, , +12

1–3 of 3