David Ho Soon Wee

Publications

149

Citations

H-Index

2010

Active since

Affiliations

Agency for Science, Technology and Research(Current)

Institute of Microelectronics

Carl Zeiss (United States)

Institute for Infocomm Research

David Ho Soon Wee is an author at Agency for Science, Technology and Research specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicroelectronicsComputer EngineeringElectrical EngineeringElectromagnetic CompatibilityMaterial ScienceMicrofabricationAdvanced PackagingComputer Architecture

Publications per year

2010–2021

Publications

Development of Package-on-Package Using Embedded Wafer-Level Package Approach

Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 26 citations

Engineering, Computer Architecture, Software Engineering +19

Electrical Design for the Development of FOWLP for HBM Integration

Teck Guan Lim, David Ho Soon Wee · 2018 · 20 citations

High Density, 3D Ic Architecture, Electrical Engineering +13

FOWLP electrical performances

Lim Teck Guan, Chan Kai Fai, David Ho Soon Wee · 2016 · 18 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning

Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang et al. · 2021 · 18 citations

Geometric Learning, Engineering, Machine Learning +23

Process challenges and development of eWLP

Ser Choong Chong, Chee Houe Khong, Keith Lim Cheng Sing et al. · 2010 · 16 citations

Engineering, Industrial Engineering, Wireless Lan +20

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