Teck Guan Lim

Statistics

Publications

Citations

432

H-Index

Active since

2009

Affiliations

Agency for Science, Technology and Research(Current)

Institute of Microelectronics

Teck Guan Lim is an author at Agency for Science, Technology and Research specializing in engineering, electrical engineering, and integrated circuit design.

Publications per year

2009–2024

Publications

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

En‐Xiao Liu, Er‐Ping Li, Wei-Bin Ewe et al. · IEEE Transactions on Microwave Theory and Techniques · 2011 · 80 citations

Engineering, Electrical Engineering, Circuit Theory +16

TSV Technology for Millimeter-Wave and Terahertz Design and Applications

Sanming Hu, Lei Wang, Yong‐Zhong Xiong et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2010 · 71 citations

Engineering, Electrical Engineering, Antennas +16

Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration

Rui Li, Jin Cheng, Siong Chiew Ong et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 42 citations

Engineering, Automotive Engineering, Electrical Engineering +17

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Ying Ying Lim, Xianghua Xiao, Srinivasa Rao Vempati et al. · IEEE Transactions on Advanced Packaging · 2010 · 33 citations

Engineering, Electrical Engineering, Microwave Engineering +16

77-GHz Automotive Radar Sensor System With Antenna Integrated Package

Ka Fai Chang, Rui Li, Teck Guan Lim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 31 citations

Engineering, Automotive Engineering, Electrical Engineering +17

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