Ka Fai Chang - Concepedia

Author

Ka Fai Chang

Agency for Science, Technology and Research

Also Known As

Ka Fai Chang

Publications

397

Citations

H-Index

Concepts

All Affiliations

Agency for Science, Technology and Research Institute of Microelectronics

About

Ka Fai Chang is an author at Agency for Science, Technology and Research specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	293
2	Computer Engineering	6	6	261
3	Electrical Engineering	6	6	221
4	Applied Physics	4	4	191
5	Materials Science	1	1	12

Ka Fai Chang

Publications

352

Citations

H-Index

Page 1

	Year	Citations
Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Applied Physics Reviews EngineeringVlsi DesignDevice IntegrationComputer ArchitectureHeterogeneous 2.5D	2015	155
Miniaturized cross-coupled filter with second and third spurious responses suppression Ka Fai Chang, Kam‐Weng Tam IEEE Microwave and Wireless Components Letters PhotonicsCross-coupled FilterFiltering TechniqueFilter BankFilter (Signal Processing)	2005	59
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration Rui Li, Jin Cheng, Siong Chiew Ong, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringEmwlp ModuleElectromagnetic CompatibilityFrequency BandAdvanced Packaging (Semiconductors)	2013	42
77-GHz Automotive Radar Sensor System With Antenna Integrated Package Ka Fai Chang, Rui Li, Jin Cheng, IEEE Transactions on Components Packaging and Manufacturing Technology Transceiver Bare DieEngineeringElectromagnetic CompatibilityLevel PackagingAdvanced Packaging (Semiconductors)	2014	30
Self-Shielded Circularly Polarized Antenna-in-Package Based on Quarter Mode Substrate Integrated Waveguide Subarray Jin Cheng, Rui Li, Sanming Hu, IEEE Transactions on Components Packaging and Manufacturing Technology Electrical EngineeringEngineeringSelf-shielded Antenna-in-packageQmsiw SubarrayAntenna	2014	20
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, Seng‐Tiong Ho, Li Yu, IEEE Design and Test EngineeringDevice IntegrationIntegrated CircuitsRedistribution LayersInterconnect (Integrated Circuits)	2015	12
An Analytical Capacitance Model for Through-Silicon Vias in Floating Silicon Substrate Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, IEEE Transactions on Electron Devices EngineeringVlsi DesignRobust Grounding SchemesSilicon On InsulatorInterconnect (Integrated Circuits)	2016	12
3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and Beyond Do‐Won Kim, Li Yu, Ka Fai Chang, Epic Packaging PlatformEngineeringDevice IntegrationOptoelectronic DevicesIntegrated Circuits	2018	12
High bandwidth interconnect design opportunities in 2.5D Through-Silicon interposer (TSI) Roshan Weerasekera, Ka Fai Chang, Songbai Zhang, EngineeringVlsi DesignSilicon Interposer TechnologiesComputer ArchitectureInterconnect (Integrated Circuits)	2016	10

Page 1