Ying Ying Lim

Scalable Fabrication of Organic Single-Crystalline Wafers for Reproducible TFT Arrays

Shohei Kumagai, Akifumi Yamamura, Tatsuyuki Makita et al. · Scientific Reports · 2019 · 67 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices

Bangtao Chen, Vasarla Nagendra Sekhar, Ying Ying Lim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 47 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Temperature dependency on Ce-doped CuO nanoparticles: a comparative study via XRD line broadening analysis

S. Jimkeli Singh, Ying Ying Lim, Jehova Jire L. Hmar et al. · Applied Physics A · 2022 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +13

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

Srinivasa Rao Vempati, Nandar Su, Chee Houe Khong et al. · 2009 · 42 citations

Engineering, Biomedical Engineering, Microelectromechanical Systems +14

Embedded wafer level packages with laterally placed and vertically stacked thin dies

Gaurav Sharma, Vempati Srinivas Rao, Aditya Kumar et al. · 2009 · 34 citations

Engineering, Electrical Engineering, Microelectronics +16