En‐Xiao Liu

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er‐Ping Li, Xing‐Chang Wei, A.C. Cangellaris et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 206 citations

Em Compatibility, Engineering, Printed Circuit Boards +20

A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects

E.-P. Li, En‐Xiao Liu, Le‐Wei Li et al. · IEEE Transactions on Advanced Packaging · 2004 · 93 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17

An Iterative Approach for EMI Source Reconstruction Based on Phaseless and Single-Plane Near-Field Scanning

Yufei Shu, Xing‐Chang Wei, Rui Yang et al. · IEEE Transactions on Electromagnetic Compatibility · 2017 · 85 citations

Engineering, Single-plane Near-field Scanning, Electromagnetic Compatibility +19

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

En‐Xiao Liu, Er‐Ping Li, Wei-Bin Ewe et al. · IEEE Transactions on Microwave Theory and Techniques · 2011 · 80 citations

Engineering, Integrated Circuits, Through-silicon Via +18

An Effective and Efficient Approach for Radiated Emission Prediction Based on Amplitude-Only Near-Field Measurements

Wei‐Jiang Zhao, Binfang Wang, En‐Xiao Liu et al. · IEEE Transactions on Electromagnetic Compatibility · 2012 · 61 citations

Engineering, Far-field Measurement, Radio Communication +22