Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging

Reliability of MEMS packaging: vacuum maintenance and packaging induced stress

Sung‐Hoon Choa · Microsystem Technologies · 2005 · 84 citations

Engineering, Mechatronics Engineering, Mechanical Behavior Of Materials +15

An updated review of getters and gettering

T. A. Giorgi, B. Ferrario, Brian D. Storey · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1985 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +9

Transfer of metal MEMS packages using a wafer-level solder transfer technique

Warren C. Welch, Junseok Chae, K. Najafi · IEEE Transactions on Advanced Packaging · 2005 · 60 citations

Engineering, Materials Engineering, Materials Science +17

Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique

A. Deutsch, T.-M. Winkel, G.V. Kopcsay et al. · IEEE Transactions on Advanced Packaging · 2005 · 60 citations

Engineering, Electrical Engineering, Materials Science +17

Gold-indium Transient Liquid Phase (TLP) wafer bonding for MEMS vacuum packaging

Warren C. Welch, Khalil Najafi · Proceedings, IEEE micro electro mechanical systems · 2008 · 57 citations

Engineering, Electrical Engineering, Materials Science +12