Concepedia

Sensor Packaging

Sensor Packaging is a specialized process in microelectromechanical systems (MEMS) technology that integrates a sensing element into a protective enclosure while ensuring mechanical stability, electrical connectivity, and environmental robustness, thereby distinguishing it from other sensor fabrication stages by its focus on functional reliability and integration readiness for real-world applications.

210

Publications

7K

Citations

919

Authors

259

Institutions

Publications per year

2017–2026

34

Parents

Publications

210

Smart Packaging: Opportunities and Challenges

Dirk Schaefer, Wai Ming Cheung · Procedia CIRP · 2018 · 350 citations · Full text

, , +16

An overview of integratable current sensor technologies

Chucheng Xiao, Lingyin Zhao, T. Asada et al. · 2004 · 225 citations

, , +16

Practical Implementation of Optical Fiber Sensors in Civil Structural Health Monitoring

Farhad Ansari · Journal of Intelligent Material Systems and Structures · 2007 · 197 citations

, , +17

Polymer integration for packaging of implantable sensors

Yiheng Qin, Matiar M. R. Howlader, M. Jamal Deen et al. · Sensors and Actuators B Chemical · 2014 · 159 citations

, , +14

A Novel Optical Fiber Sensor for Steel Corrosion in Concrete Structures

Christopher K.Y. Leung, Kai Tai Wan, Liquan Chen · Sensors · 2008 · 117 citations · Full text

, , +17

1–5 of 210

Authors

919

  1. PA
    Pamela Abshire

    University of Maryland, College Park, United States

    4 publications · 124 citations

    4

    h-index

  2. TB
    Tanja Braun

    Fraunhofer Institute for Reliability and Microintegration, Germany

    5 publications · 99 citations

    4

    h-index

  3. SV
    S. Voges

    Fraunhofer Institute for Reliability and Microintegration, Germany

    3 publications · 60 citations

    3

    h-index

  4. KB
    Karen Birkelund

    Technical University of Denmark, Denmark

    3 publications · 56 citations

    3

    h-index

  5. ES
    Elisabeth Smela

    University of Maryland, College Park, United States

    3 publications · 108 citations

    3

    h-index

1–5 of 919

Institutions

259

  1. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    12 h-index

    41 publications

    1.2K citations

  2. Analog Devices (United States)

    Norwood, United States

    8 h-index

    43 publications

    1.1K citations

  3. Technische Universität Berlin

    Berlin, Germany

    6 h-index

    22 publications

    421 citations

  4. Chinese Academy of Sciences

    Beijing, China

    5 h-index

    27 publications

    652 citations

  5. State Key Laboratory of Transducer Technology

    Shanghai, China

    5 h-index

    10 publications

    164 citations

  6. University of Maryland, College Park

    College Park, United States

    5 h-index

    19 publications

    523 citations

  7. Shanghai Institute of Microsystem and Information Technology

    Shanghai, China

    4 h-index

    16 publications

    332 citations

  8. University of Michigan

    Ann Arbor, United States

    4 h-index

    12 publications

    319 citations

1–8 of 259

Venues

  1. Sensors and Actuators A Physical

    24 publications · 882 citations

    18

    h-index

  2. 11

    h-index

  3. IEEE Transactions on Advanced Packaging

    7 publications · 256 citations

    7

    h-index

  4. Sensors

    6 publications · 304 citations

    6

    h-index

  5. Journal of Micromechanics and Microengineering

    JMM · 7 publications · 278 citations

    6

    h-index

1–5