Tanja Braun - Concepedia

Author

Tanja Braun

Fraunhofer Institute for Reliability and Microintegration

Also Known As

Braun, T., Braun, Tanja, Braun, Tim, Martin Blechert, T Braun, T. Braun, Tanja Braun, Tim Braun

186

Publications

1.3K

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Technische Universität Berlin Infineon Technologies (Germany)

About

Tanja Braun is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	33	795
2	Applied Physics	6	6	176
3	Biomedical Engineering	5	6	128
4	Business	2	2	52
5	Social Sciences	1	1	40

Tanja Braun

Publications

979

Citations

H-Index

Page 1

	Year	Citations
Large area compression molding for Fan-out Panel Level Packing Tanja Braun, S. Raatz, S. Voges, Advanced PackagingChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale Processing	2015	76
Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications Torsten Linz, René Vieroth, Christian Dils, Advances in science and technology Smart TextileEngineeringMechanical EngineeringWearable TechnologyE-textiles	2008	75
TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules Kai Zoschke, J.K. Wolf, Christina Lopper, EngineeringSilicon ViasSip ModulesIntegrated CircuitsSilicon Interposers	2011	61
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck, Micromachines	2019	50
From wafer level to panel level mold embedding Tanja Braun, K.-F. Becker, S. Voges,	2013	44
Through mold vias for stacking of mold embedded packages Tanja Braun, K.-F. Becker, S. Voges, Large AreaEngineeringMechanical EngineeringComputer-aided DesignIntegrated Circuits	2011	40
Panel Level Packaging - A View Along the Process Chain Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck, EngineeringIndustrial EngineeringIntegrated CircuitsMaterial HandlingWafer Scale Processing	2018	39
Development of a Multi-project Fan-Out Wafer Level Packaging Platform Tanja Braun, S. Raatz, Marius van Dijk, EngineeringComputer ArchitectureMulti-layer StructureAdvanced Packaging (Semiconductors)Heterogeneous Integration	2017	32
Large area embedding for heterogeneous system integration Tanja Braun, K.-F. Becker, L. Böttcher, Large AreaCluster ComputingTransfer MoldingHeterogeneous ComputingEngineering	2010	25
24"×18" Fan-out panel level packing Tanja Braun, K.-F. Becker, S. Voges, Advanced PackagingChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale Processing	2014	24

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