Tanja Braun

Publications

979

Citations

H-Index

2002

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Infineon Technologies (Germany)

Tanja Braun is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicrofabricationMicroelectronicsAdvanced PackagingElectrical Engineering3D PrintingMaterial ScienceMechanical EngineeringComputer Engineering

Publications per year

2002–2022

Publications

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 76 citations

Advanced Packaging, Chip-scale Package, Engineering +15

Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications

Torsten Linz, René Vieroth, Christian Dils et al. · Advances in science and technology · 2008 · 75 citations · Full text

Smart Textile, Engineering, Mechanical Engineering +16

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Silicon Vias, Sip Modules +20

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · Micromachines · 2019 · 50 citations · Full text

From wafer level to panel level mold embedding

Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations

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