S. Voges

Statistics

Publications

Citations

526

H-Index

Active since

2011

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

S. Voges is an author at Fraunhofer Institute for Reliability and Microintegration specializing in packaging engineering, engineering, and fan-out wafer-level packaging.

Publications per year

2011–2022

Publications

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 77 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +11

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · Micromachines · 2019 · 51 citations · Full text

Engineering, Manufacturing Engineering, Energy Systems +14

From wafer level to panel level mold embedding

Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations

Engineering, Manufacturing Engineering, Materials Science +14

Through mold vias for stacking of mold embedded packages

Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Panel Level Packaging - A View Along the Process Chain

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 40 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13

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