6
Publications
174
Citations
6
H-Index
2015
Active since
S. Raatz is an author at Technische Universität Berlin specializing in electronic packaging, microfabrication, and engineering.
Top concepts
EngineeringMicroelectronicsMicrofabricationElectronic PackagingAdvanced PackagingElectrical Engineering3D PrintingHeterogeneous IntegrationIntegrated CircuitsComputer Engineering
Publications per year
2015–2017
6
6
Large area compression molding for Fan-out Panel Level Packing
Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 76 citations
Development of a Multi-project Fan-Out Wafer Level Packaging Platform
Tanja Braun, S. Raatz, Marius van Dijk et al. · 2017 · 32 citations
Engineering, Computer Architecture, Multi-layer Structure +16
Material and process trends for moving from FOWLP to FOPLP
Tanja Braun, S. Voges, Michael J. Topper et al. · 2015 · 23 citations
Materials Science, Advanced Packaging, Electrical Engineering +15
From fan-out wafer to fan-out panel level packaging
Tanja Braun, Karl‐Friedrich Becker, S. Raatz et al. · 2015 · 17 citations
Engineering, Integrated Circuits, Biomedical Engineering +19
Potential and challenges of fan-out panel level packaging
Tanja Braun, Karl‐Friedrich Becker, R. Kahle et al. · 2016 · 14 citations
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