Marius van Dijk

Statistics

Publications

Citations

124

H-Index

Active since

2012

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Marius van Dijk is an author at Fraunhofer Institute for Reliability and Microintegration specializing in mechanical behavior of materials, materials science, and engineering.

ORCID

Publications per year

2012–2022

Publications

Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications

Constanze Weber, H. Walter, Marius van Dijk et al. · 2016 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +17

Development of a Multi-project Fan-Out Wafer Level Packaging Platform

Tanja Braun, S. Raatz, Marius van Dijk et al. · 2017 · 32 citations

Engineering, Electrical Engineering, Electronic Materials +16

Experimental and simulative study of warpage behavior for fan-out wafer-level packaging

Marius van Dijk, Saskia Huber, Andreas Stegmaier et al. · Microelectronics Reliability · 2022 · 19 citations

Engineering, Materials Engineering, Materials Science +12

A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

Ivan Ndip, Kristoffer Andersson, Stefan Kosmider et al. · 2020 · 15 citations

Engineering, Electrical Engineering, Systems Engineering +17

Simulation challenges of warpage for wafer- and panel level packaging

Marius van Dijk, Simon Kuttler, Florian Rost et al. · 2020 · 13 citations

Engineering, Materials Science, Mechanical Behavior Of Materials +13

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