Ivan Ndip

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 151 citations

Engineering, Electrical Engineering, Microelectronics +16

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Michael J. Topper, Ivan Ndip, Robert Erxleben et al. · 2010 · 146 citations

Engineering, Electrical Engineering, Materials Science +16

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ivan Ndip, Kai Zoschke, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 84 citations

Engineering, Electrical Engineering, Microelectronics +16

Through-The-Wall Detection With Gated FMCW Signals Using Optimized Patch-Like and Vivaldi Antennas

Francesco Fioranelli, Sana Salous, Ivan Ndip et al. · IEEE Transactions on Antennas and Propagation · 2015 · 57 citations · Full text

Engineering, Electrical Engineering, Antennas +16

Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

Ivan Ndip, Abdurrahman Öz, H. Reichl et al. · IEEE Transactions on Electromagnetic Compatibility · 2014 · 45 citations

Engineering, Electrical Engineering, Materials Science +17