Kai Löbbicke

Statistics

Publications

Citations

272

H-Index

Active since

2010

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Kai Löbbicke is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electronic packaging, electrical engineering, and electromagnetic compatibility.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringElectromagnetic CompatibilityComputational ElectromagneticsAntennaApplied PhysicsMicrowave Engineering3D Integration

Publications per year

2010–2013

Publications

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 147 citations

3-D Chip Integration, Engineering, Electromagnetic Compatibility +19

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ivan Ndip, Kai Zoschke, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 82 citations

Engineering, Silicon Vias, Integrated Circuits +16

Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and Boards

Ivan Ndip, Florian Ohnimus, Kai Löbbicke et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 43 citations

Advanced Packaging, Emr Problems, Electrical Engineering +14

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