Brian Curran

Statistics

Publications

Citations

157

H-Index

Active since

2008

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Brian Curran is an author at Fraunhofer Institute for Reliability and Microintegration specializing in computational electromagnetics, engineering, and electromagnetic compatibility.

Top concepts

EngineeringMicroelectronicsComputer EngineeringElectronic PackagingElectrical EngineeringElectromagnetic CompatibilityComputational ElectromagneticsAntennaVlsi Design3D Integration

Publications per year

2008–2011

Publications

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 147 citations

3-D Chip Integration, Engineering, Electromagnetic Compatibility +19

Managing Losses in Through Silicon Vias with Different Return Current Path Configurations

Brian Curran, Ivan Ndip, Stephan Guttovski et al. · 2008 · 10 citations

3D Ic Architecture, Electrical Engineering, Physical Design (Electronics) +14

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