Robert Erxleben

Statistics

Publications

Citations

224

H-Index

Active since

2006

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Robert Erxleben is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringPhotonicsApplied PhysicsOptoelectronicsMicroelectronicsOptical MaterialsAdvanced PackagingOptical Properties

Publications per year

2006–2010

Publications

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Michael J. Topper, Ivan Ndip, Robert Erxleben et al. · 2010 · 142 citations

Engineering, Through Glass Vias, Integrated Circuits +16

glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects

H. Schröder, Lars Brusberg, Robert Erxleben et al. · 2010 · 30 citations

Pcb Integration, Optical Materials, Engineering +20

Air- and spaceborne monitoring of road traffic using SAR moving target indication—Project TRAMRAD

K.-H. Bethke, Stefan V. Baumgartner, Martina Gabele et al. · ISPRS Journal of Photogrammetry and Remote Sensing · 2006 · 29 citations

Radar, Engineering, Synthetic Aperture Radar +10

Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling

Lars Brusberg, H. Schröder, Robert Erxleben et al. · 2010 · 23 citations

Waveguides, Optical Materials, Engineering +20

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