Lars Brusberg

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Michael J. Topper, Ivan Ndip, Robert Erxleben et al. · 2010 · 142 citations

Engineering, Through Glass Vias, Integrated Circuits +16

Advances in CO2-Laser Drilling of Glass Substrates

Lars Brusberg, Marco Queisser, Clemens Gentsch et al. · Physics Procedia · 2012 · 53 citations · Full text

Materials Engineering, Materials Science, Laser Optics +14

Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging

Lars Brusberg, Aramais R. Zakharian, Şükrü Ekin Kocabaş et al. · Journal of Lightwave Technology · 2020 · 35 citations

Waveguides, Optical Materials, Engineering +24

Glass Platform for Co-Packaged Optics

Lars Brusberg, Jason R. Grenier, Aramais R. Zakharian et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2023 · 34 citations

Optical Design, Glass Platform, Optical Materials +24

glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects

H. Schröder, Lars Brusberg, Robert Erxleben et al. · 2010 · 30 citations

Pcb Integration, Optical Materials, Engineering +20