Lars Brusberg

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Michael J. Topper, Ivan Ndip, Robert Erxleben et al. · 2010 · 146 citations

Engineering, Electrical Engineering, Materials Science +16

Advances in CO2-Laser Drilling of Glass Substrates

Lars Brusberg, Marco Queisser, Clemens Gentsch et al. · Physics Procedia · 2012 · 54 citations · Full text

Engineering, Materials Engineering, Materials Science +13

Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging

Lars Brusberg, Aramais R. Zakharian, Şükrü Ekin Kocabaş et al. · Journal of Lightwave Technology · 2020 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Glass Platform for Co-Packaged Optics

Lars Brusberg, Jason R. Grenier, Aramais R. Zakharian et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2023 · 36 citations

Engineering, Electrical Engineering, Materials Engineering +17

glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects

H. Schröder, Lars Brusberg, Robert Erxleben et al. · 2010 · 32 citations

Engineering, Electrical Engineering, Materials Engineering +17