H. Reichl - Concepedia

Author

H. Reichl

Fraunhofer Institute for Reliability and Microintegration

Also Known As

H Reichl, H. REICHL, H. Reichl, Herbert REICHL, Herbert Reichl, Reichl, H., Reichl, Herbert, Reischl, H.

647

Publications

8.5K

Citations

H-Index

254

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Technische Universität Berlin Fraunhofer-Gesellschaft

About

H. Reichl is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	42	210	6.8K
2	Education	7	7	261
3	Natural Sciences	4	4	93
4	Social Sciences	3	3	59
5	Business	2	2	35

H. Reichl

223

Publications

Citations

H-Index

Page 1

	Year	Citations
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation Andreas Schubert, R. Dudek, E. Auerswald, Materials ScienceFlip ChipFatigue LifeReliability EngineeringEngineering	2003	383
Interlayer cooling potential in vertically integrated packages Thomas Brunschwiler, Bruno Michel, H. Rothuizen, Microsystem Technologies Chip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip AttachmentThermodynamics	2008	185
High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes Ivan Ndip, Brian Curran, Kai Löbbicke, IEEE Transactions on Components Packaging and Manufacturing Technology 3-D Chip IntegrationEngineeringElectromagnetic CompatibilityPhysical Design (Electronics)Advanced Packaging (Semiconductors)	2011	147
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer Michael J. Topper, Ivan Ndip, Robert Erxleben, EngineeringThrough Glass ViasIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale Processing	2010	142
Development of a planar micro fuel cell with thin film and micro patterning technologies Robert Hahn, Stefan Wagner, Andreas Schmitz, Journal of Power Sources Materials ScienceElectrical EngineeringEngineeringMicromachinesMicrofabrication	2004	139
Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric Torsten Linz, Christine Kallmayer, R. Aschenbrenner, Smart TextileEngineeringWearable TechnologyE-textilesSoft Robotics	2005	133
Through silicon via technology — processes and reliability for wafer-level 3D system integration Peter Ramm, M. J. Wolf, Armin Klumpp, EngineeringWafer-level Die StackingSlid Metal SystemDevice IntegrationIntegrated Circuits	2008	118
Efficient HF Modeling and Model Parameterization of Induction Machines for Time and Frequency Domain Simulations M. Schinkel, S. Weber, Stephan Guttowski, Induction MachinesEngineeringElectric MachineMotor DriveEfficient Hf Modeling	2006	112
High aspect ratio TSV copper filling with different seed layers M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle, Materials ScienceElectrical EngineeringDifferent Seed LayersEngineeringElectromigration Technique	2008	109
Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders Mingliang Huang, T. Loeher, Andreas Ostmann, Applied Physics Letters Materials ScienceMaterials EngineeringEngineeringDissolution RateCorrosion	2005	91

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