H. Reichl

Statistics

Publications

223

Citations

7.1K

H-Index

Active since

1975

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Fraunhofer-Gesellschaft

H. Reichl is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials science, and materials engineering.

Publications per year

1975–2014

223

Publications

223

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Andreas Schubert, R. Dudek, E. Auerswald et al. · 2003 · 386 citations

Engineering, Materials Engineering, Materials Science +17

Interlayer cooling potential in vertically integrated packages

Thomas Brunschwiler, Bruno Michel, H. Rothuizen et al. · Microsystem Technologies · 2008 · 187 citations

Engineering, Materials Engineering, Mechanical Engineering +10

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 151 citations

Engineering, Electrical Engineering, Microelectronics +16

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Michael J. Topper, Ivan Ndip, Robert Erxleben et al. · 2010 · 146 citations

Engineering, Electrical Engineering, Materials Science +16

Development of a planar micro fuel cell with thin film and micro patterning technologies

Robert Hahn, Stefan Wagner, Andreas Schmitz et al. · Journal of Power Sources · 2004 · 139 citations

Engineering, Materials Engineering, Materials Science +13

1–5 of 223