Publication | Closed Access
Interlayer cooling potential in vertically integrated packages
185
Citations
17
References
2008
Year
Chip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip AttachmentThermodynamicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringRefrigeration
| Year | Citations | |
|---|---|---|
Page 1
Page 1