U. Kloter

High heat flux flow boiling in silicon multi-microchannels – Part I: Heat transfer characteristics of refrigerant R236fa

Bruno Agostini, John R. Thome, M. Fabbri et al. · International Journal of Heat and Mass Transfer · 2008 · 188 citations · Full text

Heat Transfer Characteristics, Engineering, Heat Transfer Process +8

Interlayer cooling potential in vertically integrated packages

Thomas Brunschwiler, Bruno Michel, H. Rothuizen et al. · Microsystem Technologies · 2008 · 185 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +7

High heat flux flow boiling in silicon multi-microchannels – Part III: Saturated critical heat flux of R236fa and two-phase pressure drops

Bruno Agostini, Rémi Revellin, John R. Thome et al. · International Journal of Heat and Mass Transfer · 2008 · 130 citations · Full text

Critical Heat Flux, Heat Transfer Process, Engineering +7

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

Thomas Brunschwiler, H. Rothuizen, M. Fabbri et al. · 2006 · 119 citations

Engineering, Flow Control, Liquid Metal Cooling +19

High heat flux flow boiling in silicon multi-microchannels – Part II: Heat transfer characteristics of refrigerant R245fa

Bruno Agostini, John R. Thome, M. Fabbri et al. · International Journal of Heat and Mass Transfer · 2008 · 82 citations · Full text

Heat Transfer Process, Refrigerant R245fa, Engineering +6