Thomas Brunschwiler

3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · 2010 · 275 citations · Full text

Engineering, Liquid Metal Cooling, Integrated Circuits +22

3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · International Conference on Computer Aided Design · 2010 · 236 citations

Engineering, Liquid Metal Cooling, Computer Architecture +23

Energy efficient hotspot-targeted embedded liquid cooling of electronics

Chander Shekhar Sharma, Manish K. Tiwari, Severin Zimmermann et al. · Applied Energy · 2014 · 203 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +10

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

W. Escher, Thomas Brunschwiler, Bruno Michel et al. · Journal of Heat Transfer · 2010 · 193 citations

Heat Transfer Process, Engineering, Experimental Investigation +14

Interlayer cooling potential in vertically integrated packages

Thomas Brunschwiler, Bruno Michel, H. Rothuizen et al. · Microsystem Technologies · 2008 · 185 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +7