Thomas Brunschwiler

3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · 2010 · 279 citations · Full text

Engineering, Computer Engineering, Heat Transfer +16

3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · 2010 · 236 citations · Full text

Engineering, Computer Engineering, Heat Transfer +16

Energy efficient hotspot-targeted embedded liquid cooling of electronics

Chander Shekhar Sharma, Manish K. Tiwari, Severin Zimmermann et al. · Applied Energy · 2014 · 211 citations

Engineering, Computer Engineering, Electrical Engineering +12

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

W. Escher, Thomas Brunschwiler, Bruno Michel et al. · Journal of Heat Transfer · 2010 · 201 citations

Engineering, Mechanical Engineering, Fluid Dynamics +16

Interlayer cooling potential in vertically integrated packages

Thomas Brunschwiler, Bruno Michel, H. Rothuizen et al. · Microsystem Technologies · 2008 · 187 citations

Engineering, Materials Engineering, Mechanical Engineering +10