Arvind Sridhar

3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · 2010 · 279 citations · Full text

Engineering, Computer Engineering, Heat Transfer +16

3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · 2010 · 236 citations · Full text

Engineering, Computer Engineering, Heat Transfer +16

3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Arvind Sridhar, Alessandro Vincenzi, David Atienza et al. · IEEE Transactions on Computers · 2013 · 113 citations · Full text

Engineering, Computer Engineering, Computer Systems +17

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero et al. · Infoscience (Ecole Polytechnique Fédérale de Lausanne) · 2010 · 52 citations · Full text

Engineering, Computer Engineering, Computational Fluid Dynamics +16

Thermal modeling and analysis of 3D multi-processor chips

José L. Ayala, Arvind Sridhar, David Cuesta · Integration · 2010 · 40 citations · Full text

Engineering, Computer Engineering, Computer Systems +14