R. Dudek

Publications

1.5K

Citations

H-Index

1994

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Fraunhofer Institute for Electronic Nano Systems

Infineon Technologies (Germany)

Robert Bosch (Germany)

Micro Materials (United Kingdom)

R. Dudek is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, mechanical engineering, and mechanics of materials.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsMaterial ScienceSolid MechanicsMicroelectronicsElectrical EngineeringMicrostructureReliability Engineering

Publications per year

1994–2021

Publications

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Andreas Schubert, R. Dudek, E. Auerswald et al. · 2003 · 383 citations

Materials Science, Flip Chip, Fatigue Life +15

Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

Andreas Schubert, H. Walter, R. Dudek et al. · 2001 · 79 citations

Engineering, Mechanical Engineering, Cold Working +16

Reliability assessment of flip-chip assemblies with lead-free solder joints

Andreas Schubert, R. Dudek, H. Walter et al. · 2002 · 75 citations

Electrical Resistance, Engineering, Reliability Assessment +19

An efficient approach to predict solder fatigue life and its application to SM- and area array components

R. Dudek, Margareta Nylén, Andreas Schubert et al. · 2002 · 52 citations

Engineering, Industrial Engineering, Life Prediction +23

Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism

R. Dudek, H. Berek, Tobias Fritsch et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 49 citations

Engineering, Conductive Adhesive Joints, Mechanical Engineering +16

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