H. Berek

Publications

Citations

H-Index

2000

Active since

Affiliations

Fraunhofer Institute for Open Communication Systems(Current)

H. Berek is an author at Fraunhofer Institute for Open Communication Systems specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

MechanicsEngineeringPolymer ScienceMaterial ScienceElectronic PackagingStructural IntegrityMechanical Engineering

Publications per year

2000–2000

Publications

Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism

R. Dudek, H. Berek, Tobias Fritsch et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 49 citations

Engineering, Conductive Adhesive Joints, Mechanical Engineering +16

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