E. Auerswald

Publications

476

Citations

H-Index

1994

Active since

Affiliations

Fraunhofer Institute for Electronic Nano Systems(Current)

Fraunhofer Institute for Reliability and Microintegration

Chemnitz University of Technology

E. Auerswald is an author at Fraunhofer Institute for Electronic Nano Systems specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMechanics Of MaterialsMicroelectronicsApplied PhysicsSolid MechanicsMicrostructureMicrofabrication

Publications per year

1994–2017

Publications

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Andreas Schubert, R. Dudek, E. Auerswald et al. · 2003 · 383 citations

Materials Science, Flip Chip, Fatigue Life +15

Stress analyses of high spatial resolution on TSV and BEoL structures

D. Vogel, E. Auerswald, J. Auersperg et al. · Microelectronics Reliability · 2014 · 20 citations

Engineering, Strain Localization, Mechanical Engineering +10

Evaluation of Metallic Nano-Lawn Structures for Application in Microelectronic Packaging

S. Fiedler, Michael Zwanzig, Ralf Schmidt et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 16 citations

Materials Science, Chemical Engineering, Template Techniques +15

Accelerated Active High-Temperature Cycling Test for Power MOSFETs

R. Schacht, Bernhard Wunderle, E. Auerswald et al. · 2006 · 14 citations

Engineering, Accelerated Failure Tests, Packaged Power Mosfets +17

Use of an X-Ray Imaging Plate for Stress Analysis

A. Schubert, B. Kämpfe, M. Ermrich et al. · Materials science forum · 1994 · 12 citations

Engineering, Health Sciences, Mechanical Engineering +8

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