J. Auersperg

Publications

227

Citations

H-Index

1997

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Fraunhofer Institute for Electronic Nano Systems

Chemnitzer Werkstoffmechanik GmbH (Germany)

Angewandte Micro Messtechnik (Germany)

J. Auersperg is an author at Fraunhofer Institute for Reliability and Microintegration specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMechanics Of MaterialsSolid MechanicsMaterial ScienceMicroelectronicsStructural MechanicsMicrostructureFracture Mechanics

Publications per year

1997–2015

Publications

Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds

Hossein Shirangi, J. Auersperg, M. Koyuncu et al. · 2008 · 53 citations

Materials Science, Mold Control, Residual Moisture +15

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

Michael J. Topper, J. Auersperg, V. Glaw et al. · 2000 · 40 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Stress analyses of high spatial resolution on TSV and BEoL structures

D. Vogel, E. Auerswald, J. Auersperg et al. · Microelectronics Reliability · 2014 · 20 citations

Engineering, Strain Localization, Mechanical Engineering +10

Fracture mechanics based crack and delamination risk evaluation and RSM/DOE concepts for advanced microelectronics applications

J. Auersperg, B. Seiler, Eric Cadalen et al. · 2005 · 20 citations

Rsm/doe Concepts, Engineering, Mechanical Engineering +20

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

J. Auersperg, Andreas Schubert, Dietmar Vogel et al. · 1997 · 19 citations

Engineering, Mechanical Engineering, Mechanics Modeling +19

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