Concepedia

Author

J. Auersperg

Fraunhofer Institute for Reliability and Microintegration

Also Known As

Auersperg, J., J. Auersperg, Jurgen Auersperg, Jürgen Auersperg

33

Publications

301

Citations

10

H-Index

40

Concepts

All Affiliations

Fraunhofer Institute for Reliability and MicrointegrationTechnische Universität BerlinFraunhofer Institute for Electronic Nano SystemsChemnitzer Werkstoffmechanik GmbH (Germany)Angewandte Micro Messtechnik (Germany)
JA

About

J. Auersperg is an author at Fraunhofer Institute for Reliability and Microintegration specializing in mechanical engineering, engineering, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

10

11

227

2

Computer Engineering

3

3

61

3

Applied Physics

2

2

23

4

Electrical Engineering

2

2

51

5

Environmental Engineering

1

1

53

J. Auersperg

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11

Publications

227

Citations

10

H-Index

YearCitations

Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds

Hossein Shirangi, J. Auersperg, M. Koyuncu,

2008

53

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

Michael J. Topper, J. Auersperg, V. Glaw,

2000

40

Stress analyses of high spatial resolution on TSV and BEoL structures

D. Vogel, E. Auerswald, J. Auersperg,

Microelectronics Reliability

2014

20

Fracture mechanics based crack and delamination risk evaluation and RSM/DOE concepts for advanced microelectronics applications

J. Auersperg, B. Seiler, Eric Cadalen,

2005

20

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

J. Auersperg, Andreas Schubert, Dietmar Vogel,

1997

19

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

J. Auersperg, E. Kieselstein, Andreas Schubert,

Journal of Electronic Packaging

2002

18

VCCT and integral concepts of bi-material interface fracture in low-k structures — Going to understand relation

J. Auersperg, R. Dudek, B. Michel

2010

13

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

J. Auersperg, E. Kieselstein, Andreas Schubert,

2001

13

Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

Bernhard Wunderle, J. Auersperg, Eberhard Kaulfersch,

2003

11

FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact

J. Auersperg, D. Breuer, Kashi Vishwanath Machani,

2015

10

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