2006 1st Electronic Systemintegration Technology Conference

High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging

Chunghyun Ryu, Jiwang Lee, Hyein Lee et al. · 2006 · 94 citations

Engineering, Electrical Engineering, Circuit Theory +16

System on Chip Signal Conditioner for LVDT Sensors

Andrei Drumea, Alexandru Vasile, Mircea Comes et al. · 2006 · 46 citations

Engineering, Electrical Engineering, Mechatronics Engineering +17

Thermal Fatigue Life Evaluation of Aluminum Wire Bonds

Toshihiro Matsunaga, Yasumi Uegai · 2006 · 38 citations

Engineering, Materials Engineering, Materials Science +17

Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements

Holger Gaul, Martin Schneider‐Ramelow, Klaus‐Dieter Lang et al. · 2006 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +14

Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits

Jens Müller, Rubén Perrone, Heiko Thust et al. · 2006 · 27 citations

Engineering, Electrical Engineering, Materials Engineering +17