Klaus‐Dieter Lang

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 151 citations

Engineering, Electrical Engineering, Microelectronics +16

Addressing Sustainability and Flexibility in Manufacturing Via Smart Modular Machine Tool Frames to Support Sustainable Value Creation

Bernd Peukert, Stephan Benecke, Janire Clavell et al. · Procedia CIRP · 2015 · 100 citations · Full text

Engineering, Manufacturing Engineering, Systems Engineering +17

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ivan Ndip, Kai Zoschke, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 84 citations

Engineering, Electrical Engineering, Microelectronics +16

Estimating the quantities of critical metals embedded in ICT and consumer equipment

Perrine Chancerel, Max Marwede, Nils F. Nissen et al. · Resources Conservation and Recycling · 2015 · 69 citations

Natural Sciences, Materials Engineering, Critical Infrastructure Protection +13

Data availability and the need for research to localize, quantify and recycle critical metals in information technology, telecommunication and consumer equipment

Perrine Chancerel, Vera Susanne Rotter, Maximilian Ueberschaar et al. · Waste Management & Research The Journal for a Sustainable Circular Economy · 2013 · 65 citations

Engineering, Materials Engineering, Materials Science +17