R. Schacht

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

Bernhard Wunderle, Karl‐Friedrich Becker, R. Sinning et al. · Microsystem Technologies · 2009 · 45 citations

Thermo-mechanical Reliability, Reliability Engineering, Engineering +12

Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis

S. Deplanque, W. Nüchter, Bernhard Wunderle et al. · 2006 · 28 citations

Engineering, Mechanical Engineering, Lifetime Prediction +22

Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation

Bernhard Wunderle, Matthias Klein, Lothar Dietrich et al. · 2010 · 15 citations

Thermal Interface Technology, Engineering, Mechanical Engineering +17

"LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials

Mohamad Abo Ras, D. May, R. Schacht et al. · 2015 · 15 citations

Pulse Delta Technique, Engineering, Innovative Test Stand +22

Characterization of Thermal Interface Materials to Support Thermal Simulation

R. Schacht, D. May, Bernhard Wunderle et al. · ArXiv.org · 2007 · 14 citations · Full text

Engineering, Mechanical Engineering, Thermal Analysis +18