Lothar Dietrich

Statistics

Publications

Citations

166

H-Index

Active since

2006

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Lothar Dietrich is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectronic PackagingMicroelectronicsMicrofabricationNanomaterialsNanotechnologySurface ScienceAdvanced Packaging

Publications per year

2006–2011

Publications

Nanoporous gold bumps for low temperature bonding

Hermann Oppermann, Lothar Dietrich · Microelectronics Reliability · 2011 · 57 citations

Materials Science, Engineering, Nanocluster +5

Flip chip bumping technology—Status and update

M. Juergen Wolf, Gunter Engelmann, Lothar Dietrich et al. · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · 2006 · 51 citations

Flip Chip, Electrical Engineering, Engineering +9

Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder

Matthias Hütter, Hermann Oppermann, G. Engelmann et al. · 2006 · 20 citations

Engineering, Optoelectronic Devices, Flip Chip +16

Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation

Bernhard Wunderle, Matthias Klein, Lothar Dietrich et al. · 2010 · 15 citations

Thermal Interface Technology, Engineering, Mechanical Engineering +17

Nanoporous interconnects

Hermann Oppermann, Lothar Dietrich, Matthias Klein et al. · 2010 · 13 citations

Materials Science, Silver-gold Alloy, Engineering +10

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