M. Juergen Wolf

Statistics

Publications

Citations

110

H-Index

Active since

2006

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Dresden

Fraunhofer-Gesellschaft

M. Juergen Wolf is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, chip packaging, and interconnect technology.

Publications per year

2006–2019

Publications

Flip chip bumping technology—Status and update

M. Juergen Wolf, Gunter Engelmann, Lothar Dietrich et al. · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · 2006 · 52 citations

Engineering, Computer Engineering, Electrical Engineering +14

3D integration of image sensor SiP using TSV silicon interposer

M. Juergen Wolf, Kai Zoschke, Armin Klumpp et al. · 2009 · 21 citations

Engineering, Automotive Engineering, Systems Engineering +17

Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking

Iuliana Panchenko, Klaus-Juergen Wolter, Kristof Croes et al. · Microelectronics Reliability · 2019 · 15 citations

Engineering, Materials Engineering, Materials Science +15

SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform

Wolfram Steller, Christoph Meinecke, Knut Gottfried et al. · 2014 · 12 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +17

Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength

Steffen Bickel, R. Hoehne, Iuliana Panchenko et al. · 2018 · 10 citations

Engineering, Materials Engineering, Materials Science +14

1–5 of 5