Armin Klumpp - Concepedia

Author

Armin Klumpp

Fraunhofer Institute for Reliability and Microintegration ORCID

Also Known As

A Klumpp, A. Klumpp, Armin Klumpp, Klumpp, A, Klumpp, A., Klumpp, Armin

Publications

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Fraunhofer Research Institution for Microsystems and Solid State Technologies Fraunhofer-Gesellschaft Infineon Technologies (Germany)SINTEF

About

Armin Klumpp is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, microelectronics, and 3d integration.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	21	781
2	Applied Physics	8	8	152
3	Natural Sciences	3	3	153
4	Medicine	1	1	10
5	Chemistry	1	1	17

Armin Klumpp

Publications

945

Citations

H-Index

Page 1

	Year	Citations
Through silicon via technology — processes and reliability for wafer-level 3D system integration Peter Ramm, M. J. Wolf, Armin Klumpp, EngineeringWafer-level Die StackingSlid Metal SystemDevice IntegrationIntegrated Circuits	2008	118
Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding Armin Klumpp, R. Merkel, Peter Ramm, Japanese Journal of Applied Physics EngineeringMechanical EngineeringComputer ArchitectureWafer-level 3DSystem Integration	2004	81
3D Integration technology: Status and application development Peter Ramm, Armin Klumpp, Josef Weber, EngineeringDevice Integration3D ModelingItrs RoadmapComputer-aided Design	2010	80
InterChip via technology for vertical system integration Peter Ramm, Detlef Bonfert, Horst Gieser,	2001	73
3D System-on-Chip technologies for More than Moore systems Peter Ramm, Armin Klumpp, Josef Weber, Microsystem Technologies System On Chip3D Ic ArchitectureEngineeringComputer DesignComputer Architecture	2009	62
Amorphous silicon carbide and its application in silicon micromachining Armin Klumpp, U. Schaber, H.L. Offereins, Sensors and Actuators A Physical Materials ScienceMaterials EngineeringEngineeringMicrofabricationCarbide	1994	53
3D System Integration Technologies Peter Ramm, Armin Klumpp, R. Merkel, MRS Proceedings Geometric Modeling3D Ic ArchitectureEngineeringNatural SciencesSystem Integration Technologies	2003	53
Technologies for 3D wafer level heterogeneous integration M. J. Wolf, Peter Ramm, Armin Klumpp, EngineeringDevice IntegrationComputer ArchitectureInterconnect (Integrated Circuits)Wafer Scale Processing	2008	48
Chip-to-wafer stacking technology for 3D system integration Armin Klumpp, R. Merkel, Robert Wieland,	2003	47
3D Integration of CMOS transistors with ICV-SLID technology Robert Wieland, Detlef Bonfert, Armin Klumpp, Microelectronic Engineering 3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Cmos Transistors	2005	37

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