Armin Klumpp

Through silicon via technology — processes and reliability for wafer-level 3D system integration

Peter Ramm, M. J. Wolf, Armin Klumpp et al. · 2008 · 118 citations

Engineering, Wafer-level Die Stacking, Slid Metal System +22

Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding

Armin Klumpp, R. Merkel, Peter Ramm et al. · Japanese Journal of Applied Physics · 2004 · 81 citations

Engineering, Mechanical Engineering, Computer Architecture +19

3D Integration technology: Status and application development

Peter Ramm, Armin Klumpp, Josef Weber et al. · 2010 · 80 citations · Full text

Engineering, Device Integration, 3D Modeling +25

InterChip via technology for vertical system integration

Peter Ramm, Detlef Bonfert, Horst Gieser et al. · 2001 · 73 citations

3D System-on-Chip technologies for More than Moore systems

Peter Ramm, Armin Klumpp, Josef Weber et al. · Microsystem Technologies · 2009 · 62 citations

System On Chip, 3D Ic Architecture, Engineering +6