Detlef Bonfert

Publications

214

Citations

H-Index

2001

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Universitatea Națională de Știință și Tehnologie Politehnica București

Fraunhofer Research Institution for Microsystems and Solid State Technologies

Technische Universität Dresden

Detlef Bonfert is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electrical engineering, and microelectronics.

Top concepts

EngineeringElectrical EngineeringMicroelectronicsElectronic PackagingMaterial ScienceMicrofabricationElectrical InsulationMechanical EngineeringMechanics3D Printing

Publications per year

2001–2016

Publications

InterChip via technology for vertical system integration

Peter Ramm, Detlef Bonfert, Horst Gieser et al. · 2001 · 73 citations

3D Integration of CMOS transistors with ICV-SLID technology

Robert Wieland, Detlef Bonfert, Armin Klumpp et al. · Microelectronic Engineering · 2005 · 37 citations

3D Ic Architecture, Electrical Engineering, Engineering +5

Developing a transient induced latch-up standard for testing integrated circuits

Mary Alexandria Kelly, L. Henry, Jon Barth et al. · 2003 · 25 citations

Electrical Engineering, Latch Event, Engineering +14

Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis

Christof Landesberger, Nagarajan Palavesam, Waltraud Hell et al. · 2016 · 23 citations

Properties of conductive microstructures containing nano sized silver particles

Jan Felba, K. Nitsch, Tomasz Piasecki et al. · 2009 · 19 citations

Engineering, Metal Nanoparticles, Silver Particles +17

Rows per page

1–5 of 8