Detlef Bonfert - Concepedia

Author

Detlef Bonfert

Fraunhofer Institute for Reliability and Microintegration

Also Known As

D. Bonfert, D. C. Bonfert, Detlef Bonfert

Publications

343

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Universitatea Națională de Știință și Tehnologie Politehnica București Fraunhofer Research Institution for Microsystems and Solid State Technologies Technische Universität Dresden

About

Detlef Bonfert is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	107
2	Electrical Engineering	4	4	92
3	Materials Science	2	2	34
4	Mechanical Engineering	2	2	34
5	Computer Engineering	1	1	25

Detlef Bonfert

Publications

214

Citations

H-Index

Page 1

	Year	Citations
InterChip via technology for vertical system integration Peter Ramm, Detlef Bonfert, Horst Gieser,	2001	73
3D Integration of CMOS transistors with ICV-SLID technology Robert Wieland, Detlef Bonfert, Armin Klumpp, Microelectronic Engineering 3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Cmos Transistors	2005	37
Developing a transient induced latch-up standard for testing integrated circuits Mary Alexandria Kelly, L. Henry, Jon Barth, Electrical EngineeringLatch EventEngineeringHardware-in-the-loop SimulationCircuit System	2003	25
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis Christof Landesberger, Nagarajan Palavesam, Waltraud Hell,	2016	23
Properties of conductive microstructures containing nano sized silver particles Jan Felba, K. Nitsch, Tomasz Piasecki, EngineeringMetal NanoparticlesSilver ParticlesMechanical EngineeringMetallic Nanomaterials	2009	19
Mechanical Reliability Analysis of Ultra-Thin Chip-on-Foil Assemblies under Different Types of Recurrent Bending Nagarajan Palavesam, Detlef Bonfert, Waltraud Hell, Recurrent BendingEngineeringMechanical EngineeringInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2016	15
Investigation of solder joints by thermographical analysis Paul Svasta, Ciprian Ionescu, Norocel Codreanu, Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)	2009	11
Transmission Line Pulse Stress on Thick Film Resistors Detlef Bonfert, Heinrich Wolf, Horst Gieser, Electrical EngineeringThick Film ResistorsEngineeringResistorSpecific Resistance	2007	11

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