Robert Wieland

Publications

564

Citations

H-Index

2001

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Infineon Technologies (Germany)

Technische Universität Berlin

Fraunhofer-Gesellschaft

Fraunhofer Research Institution for Microsystems and Solid State Technologies

Robert Wieland is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, 3d integration, and microelectronics.

ORCID

Top concepts

Engineering3D IntegrationMicroelectronicsComputer Engineering3D PrintingSystem IntegrationMicrofabricationSystems EngineeringElectrical EngineeringThree-dimensional Integrated Circuits

Publications per year

2001–2018

Publications

Through silicon via technology — processes and reliability for wafer-level 3D system integration

Peter Ramm, M. J. Wolf, Armin Klumpp et al. · 2008 · 118 citations

Engineering, Wafer-level Die Stacking, Slid Metal System +22

Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding

Armin Klumpp, R. Merkel, Peter Ramm et al. · Japanese Journal of Applied Physics · 2004 · 81 citations

Engineering, Mechanical Engineering, Computer Architecture +19

InterChip via technology for vertical system integration

Peter Ramm, Detlef Bonfert, Horst Gieser et al. · 2001 · 73 citations

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Silicon Vias, Sip Modules +20

3D System Integration Technologies

Peter Ramm, Armin Klumpp, R. Merkel et al. · MRS Proceedings · 2003 · 53 citations

Geometric Modeling, 3D Ic Architecture, Engineering +9

Rows per page

1–5 of 12