Christina Lopper

Publications

120

Citations

H-Index

2010

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Christina Lopper is an author at Fraunhofer Institute for Reliability and Microintegration specializing in computer engineering, electronic packaging, and microfabrication.

Top concepts

3D PrintingEngineeringMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingElectrical Engineering3D IntegrationApplied PhysicsMaterial Science

Publications per year

2010–2011

Publications

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Silicon Vias, Sip Modules +20

Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration

Kai Zoschke, Matthias Wegner, Martin Wilke et al. · 2010 · 34 citations

Carrierless design for handling and processing of ultrathin wafers

Florian Bieck, Sven Spiller, Froilan Molina et al. · 2010 · 25 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16

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