M. J. Wolf

Through silicon via technology — processes and reliability for wafer-level 3D system integration

Peter Ramm, M. J. Wolf, Armin Klumpp et al. · 2008 · 118 citations

Engineering, Wafer-level Die Stacking, Slid Metal System +22

High aspect ratio TSV copper filling with different seed layers

M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle et al. · 2008 · 109 citations

Materials Science, Electrical Engineering, Different Seed Layers +10

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ivan Ndip, Kai Zoschke, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 82 citations

Engineering, Silicon Vias, Integrated Circuits +16

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Kai Zoschke, M. J. Wolf, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2007 · 56 citations

Flip Chip, Integrated Passive Devices, Electrical Engineering +12

Photoinduced Charge Injection from Vibronically Hot Excited Molecules of a Dye Sensitizer into Acceptor States of Wide-Bandgap Oxide Semiconductors

Jacques‐E. Moser, M. J. Wolf, Frank Lenzmann et al. · Zeitschrift für Physikalische Chemie · 1999 · 51 citations · Full text

Semiconductors, Photoinduced Charge Injection, Dye Sensitizer +10