Statistics
Publications
1
Citations
109
H-Index
1
Active since
2008
Affiliations
Technische Universität Berlin(Current)
Thomas Dretschkow is an author at Technische Universität Berlin specializing in microfabrication, electrical engineering, and electronic packaging.
Publications per year
2008–2008
1
1
High aspect ratio TSV copper filling with different seed layers
M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle et al. · 2008 · 109 citations
Materials Science, Electrical Engineering, Different Seed Layers +10
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