R. Merkel

Publications

287

Citations

H-Index

1997

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

R. Merkel is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, microelectronics, and 3d integration.

Top concepts

EngineeringMicroelectronics3D IntegrationElectrical Engineering3D PrintingApplied PhysicsSystem IntegrationComputer Engineering3D ModelingSurface Science

Publications per year

1997–2015

Publications

Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding

Armin Klumpp, R. Merkel, Peter Ramm et al. · Japanese Journal of Applied Physics · 2004 · 81 citations

Engineering, Mechanical Engineering, Computer Architecture +19

3D System Integration Technologies

Peter Ramm, Armin Klumpp, R. Merkel et al. · MRS Proceedings · 2003 · 53 citations

Geometric Modeling, 3D Ic Architecture, Engineering +9

Chip-to-wafer stacking technology for 3D system integration

Armin Klumpp, R. Merkel, Robert Wieland et al. · 2003 · 47 citations

3D Integration of CMOS transistors with ICV-SLID technology

Robert Wieland, Detlef Bonfert, Armin Klumpp et al. · Microelectronic Engineering · 2005 · 37 citations

3D Ic Architecture, Electrical Engineering, Engineering +5

3D System Integration

Armin Klumpp, R. Merkel, Peter Ramm et al. · 2007 · 20 citations

Engineering, Device Integration, Computer Architecture +23

Rows per page

1–5 of 8