Nagarajan Palavesam

Statistics

Publications

Citations

171

H-Index

Active since

2014

Affiliations

Fraunhofer Research Institution for Microsystems and Solid State Technologies(Current)

Technische Universität Dresden

Nagarajan Palavesam is an author at Fraunhofer Research Institution for Microsystems and Solid State Technologies specializing in materials science, bending, and materials engineering.

ORCID

Publications per year

2014–2020

Publications

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Nagarajan Palavesam, Dieter Hemmetzberger, Christof Landesberger et al. · Flexible and Printed Electronics · 2018 · 102 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12

Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis

Christof Landesberger, Nagarajan Palavesam, Waltraud Hell et al. · 2016 · 23 citations

Engineering, Materials Engineering, Materials Science +17

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Nagarajan Palavesam, Waltraud Hell, A. Drost et al. · Electronics · 2020 · 16 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +13

Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates

Nagarajan Palavesam, Christof Landesberger, Karlheinz Bock · 2014 · 15 citations

Engineering, Materials Engineering, Materials Science +17

Mechanical Reliability Analysis of Ultra-Thin Chip-on-Foil Assemblies under Different Types of Recurrent Bending

Nagarajan Palavesam, Detlef Bonfert, Waltraud Hell et al. · 2016 · 15 citations

Engineering, Materials Engineering, Materials Science +15

1–5 of 5