Kristof Croes

SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories

Kévin Garello, Faisal Mohd-Yasin, Sébastien Couet et al. · 2018 · 186 citations · Full text

Engineering, Electrical Engineering, Materials Science +15

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 145 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 137 citations

Engineering, Materials Engineering, Materials Science +9

Impact of Wire Geometry on Interconnect <italic>RC</italic> and Circuit Delay

Ivan Ciofi, Antonino Contino, Philippe Roussel et al. · IEEE Transactions on Electron Devices · 2016 · 129 citations

Engineering, Computer Engineering, Electrical Engineering +17

Alternative metals for advanced interconnects

Christoph Adelmann, Liang Wen, Antony Premkumar Peter et al. · 2014 · 90 citations

Engineering, Electrical Engineering, Materials Engineering +17