Kristof Croes

SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories

Kévin Garello, Faisal Mohd-Yasin, Sébastien Couet et al. · 2018 · 177 citations · Full text

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 138 citations

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 135 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +8

Impact of Wire Geometry on Interconnect <italic>RC</italic> and Circuit Delay

Ivan Ciofi, Antonino Contino, Philippe Roussel et al. · IEEE Transactions on Electron Devices · 2016 · 125 citations

3D Ic Architecture, Electrical Engineering, Physical Design (Electronics) +13

Alternative metals for advanced interconnects

Christoph Adelmann, Liang Wen, Antony Premkumar Peter et al. · 2014 · 87 citations

Materials Science, Materials Engineering, Electrical Engineering +14