Olalla Varela Pedreira

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 138 citations

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 135 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +8

Interconnect metals beyond copper: reliability challenges and opportunities

Kristof Croes, Christoph Adelmann, Christopher Wilson et al. · 2018 · 83 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Olalla Varela Pedreira, Kristof Croes, A. Leśniewska et al. · 2017 · 77 citations

Reliability Study, Engineering, Beol Interconnects +17

Ruthenium metallization for advanced interconnects

Liang Wen, Christoph Adelmann, Olalla Varela Pedreira et al. · 2016 · 63 citations

Materials Engineering, Materials Science, Electrical Engineering +14