A. Leśniewska

Interconnect metals beyond copper: reliability challenges and opportunities

Kristof Croes, Christoph Adelmann, Christopher Wilson et al. · 2018 · 83 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Olalla Varela Pedreira, Kristof Croes, A. Leśniewska et al. · 2017 · 77 citations

Reliability Study, Engineering, Beol Interconnects +17

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

Marleen H. van der Veen, K. Vandersmissen, Dries Dictus et al. · 2015 · 52 citations

Engineering, Contact Fill, Emerging Memory Technology +21

Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

P. Absil, Kristof Croes, A. Leśniewska et al. · 2017 · 50 citations · Full text

Photonics, Optical Interconnects, Key Library Components +15

Testing The Limits of TaN Barrier Scaling

C. Witt, Kong Boon Yeap, A. Leśniewska et al. · 2018 · 41 citations

Engineering, Experimental Technology, Interconnect (Integrated Circuits) +23