Dries Dictus

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

Marleen H. van der Veen, K. Vandersmissen, Dries Dictus et al. · 2015 · 52 citations

Engineering, Contact Fill, Emerging Memory Technology +21

Electromigration and Thermal Storage Study of Barrierless Co Vias

Olalla Varela Pedreira, Kristof Croes, Houman Zahedmanesh et al. · 2018 · 24 citations

Materials Science, Electrical Engineering, Electromigration Technique +14

Editors' Choice—Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes

Aniruddha Joi, Kailash Venkatraman, Kuang-Chih Tso et al. · ECS Journal of Solid State Science and Technology · 2019 · 15 citations · Full text

Ru-sio2 Interface, Engineering, Electrode-electrolyte Interface +17

Influence of crystallographic orientation on dry etch properties of TiN

Dries Dictus, Denis Shamiryan, Vasile Paraschiv et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 13 citations

Engineering, Chemistry, Cl2-based Etch Plasma +16

Cobalt UBM for fine pitch microbump applications in 3DIC

Jaber Derakhshandeh, Inge De Preter, K. Vandersmissen et al. · 2015 · 10 citations

Engineering, Cobalt Ubm, Mechanical Engineering +18