Aniruddha Joi

Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte

Aniruddha Joi, Rohan Akolkar, Uziel Landau · Journal of The Electrochemical Society · 2013 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +15

Editors' Choice—Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes

Aniruddha Joi, Kailash Venkatraman, Kuang-Chih Tso et al. · ECS Journal of Solid State Science and Technology · 2019 · 15 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Pulse electrodeposition of copper-manganese alloy in deep eutectic solvent

Wei-Shen Chiang, Jun-Qian Huang, Po‐Chun Chen et al. · Journal of Alloys and Compounds · 2018 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +11

Electroless Deposition of Pb Monolayer: A New Process and Application to Surface Selective Atomic Layer Deposition

Dongjun Wu, Dhaivat Solanki, Javier Ramírez et al. · Langmuir · 2018 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +12