Concepedia
Statistics
Publications
7
Citations
155
H-Index
Active since
2014
Affiliations
IMEC(Current)
KU Leuven
Inge De Preter is an author at IMEC specializing in electronic materials, materials engineering, and engineering.
Publications per year
2014–2020
Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects
George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations
Natural Sciences, Materials Engineering, Materials Science +13
3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects
Jaber Derakhshandeh, Inge De Preter, Carine Gerets et al. · 2016 · 31 citations
Engineering, Electrical Engineering, Materials Science +15
10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman et al. · 2020 · 25 citations
Engineering, Electrical Engineering, Materials Engineering +11
Reflow process optimization for micro-bumps applications in 3D technology
Jaber Derakhshandeh, Inge De Preter, Luke England et al. · 2014 · 15 citations
Engineering, Manufacturing Engineering, Manufacturing Processes +9
3D stacking of Co- and Ni-based microbumps
Inge De Preter, Jaber Derakhshandeh, Lin Hou et al. · 2016 6th Electronic System-Integration Technology Conference (ESTC) · 2016 · 13 citations
Engineering, Materials Engineering, Materials Science +11
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