Inge De Preter

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations

Materials Engineering, Inorganic Chemistry, Materials Science +8

3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

Jaber Derakhshandeh, Inge De Preter, Carine Gerets et al. · 2016 · 31 citations

Engineering, Micromechanics, Electrical Resistance Measurement +21

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman et al. · 2020 · 25 citations

Materials Science, Electrical Engineering, Friction Welding +8

Reflow process optimization for micro-bumps applications in 3D technology

Jaber Derakhshandeh, Inge De Preter, Luke England et al. · 2014 · 15 citations

Commercial Reflow Ovens, Engineering, Reflow Process +12

3D stacking of Co- and Ni-based microbumps

Inge De Preter, Jaber Derakhshandeh, Lin Hou et al. · 2016 6th Electronic System-Integration Technology Conference (ESTC) · 2016 · 13 citations

Materials Science, Materials Engineering, Electrical Engineering +14