Carine Gerets

3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

Jaber Derakhshandeh, Inge De Preter, Carine Gerets et al. · 2016 · 31 citations

Engineering, Micromechanics, Electrical Resistance Measurement +21

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman et al. · 2020 · 25 citations

Materials Science, Electrical Engineering, Friction Welding +8

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Teng Wang, R. Daily, Giovanni Capuz et al. · 2014 · 23 citations

Engineering, Daisy Chains, Integrated Circuits +21

Key elements for sub-50μm pitch micro bump processes

Joeri De Vos, Lieve Bogaerts, Thibault Buisson et al. · 2013 · 19 citations

Engineering, Mechanical Engineering, Computer-aided Design +20

Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

Herman Oprins, Vladimir Cherman, Kenneth June Rebibis et al. · 2012 · 16 citations

Engineering, Transient Analysis, Mechanical Engineering +21