Joeri De Vos

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 96 citations

Engineering, Materials Engineering, Materials Science +17

Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration

Anne Jourdain, Filip Schleicher, Joeri De Vos et al. · 2020 · 59 citations

Engineering, Computer Engineering, Electrical Engineering +17

Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology

Lan Peng, Serena Iacovo, Fumihiro Inoue et al. · 2018 · 46 citations

Engineering, Materials Engineering, Materials Science +17

Influence of Si wafer thinning processes on (sub)surface defects

Fumihiro Inoue, Anne Jourdain, Lan Peng et al. · Applied Surface Science · 2017 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +12

New Cu “Bulge-Out” Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding

Joke De Messemaeker, Liesbeth Witters, Boyao Zhang et al. · 2023 · 34 citations

Engineering, Electrical Engineering, Materials Science +12